質 WiFi7 モジュール & Wi-Fi ハロー モジュール メーカー

The global smart street light market is undergoing a structural expansion. A report released by Research and Markets in January 2026 shows that the market is projected to grow from $35.6 billion in 2026 to $74.9 billion in 2030, representing a CAGR of 20.4%. Europe is accelerating the renovation of existing infrastructure driven by mandatory replacement policies, while emerging markets in the Asia-Pacific region are releasing incremental demand through urbanization. However, a overlooked fact is that market expansion does not equate to simpler communication solution selection. On the contrary, as the focus of renovation shifts from "new construction" to "existing infrastructure," the primary constraint on communication solutions changes from technical specifications to the question: "Can this road be dug?" The position of PLC (Power Line Carrier Communication) under this constraint is clear: the streetlights themselves are connected to the power line, the PLC uses the same cable as both a power supply and data channel, and the communication signal is transmitted along the existing line without the need for any additional communication cables. Europe: Policy mandates have created the most certain scenarios for upgrading existing PLC systems. Europe is the region with the strongest policy drive for smart street light upgrades globally. A 2026 report by Mordor Intelligence points out that the EU's Mercury Regulation 2024/1849 requires the complete phase-out of compact fluorescent lamps by December 2025 and linear fluorescent lamps by December 2026. These compliance deadlines directly triggered a surge in municipal tenders. Simultaneously, the EU requires the public sector to reduce energy consumption by 11.7% by 2030, transforming the transition to network-connected LED lighting from an "optional" to a "compliance necessity." The unique aspect of this policy window is that it targets "replacement of existing infrastructure" rather than "new construction." Many streetlights in Europe were installed decades ago, with intact power cables but missing communication cables. Adopting a solution requiring separate communication cabling would mean excavating or re-laying conduits along the entire route, resulting in unpredictable costs and time. The ability of PLCs to reuse existing power cables perfectly matches the policy's mandated time pressure with the construction constraints of upgrading existing infrastructure. German practice provides a reference: the LED upgrade of 48,000 streetlights in Munich, combined with adaptive dimming, reduced energy consumption by 93% during off-peak hours. For these types of projects, communication reliability is more important than bandwidth; the millisecond-level latency of PLCs and the engineering advantages of no-wiring are more significant than wireless solutions in this scenario. However, the European market also presents a strict cost scrutiny. Smart retrofitting costs between €300 and €500 per pole, while basic LED replacement only costs €150 to €200. This price difference means that the selection of PLC modules must withstand scrutiny regarding the question of "why not use wireless?" The answer lies not in technological superiority, but in the engineering certainty under existing wiring conditions : wireless solutions are affected by terrain and building obstructions in dense urban areas, requiring additional relay nodes in practical testing, while PLCs, assuming the power supply cable is intact, have a physically existing communication link.   China and Asia Pacific: Differences in PLC Positioning in Incremental Markets Data from China's smart light pole market presents a different picture. QYResearch statistics show that the global smart city light pole market sales reached approximately $412 million in 2025 and are projected to reach $796 million by 2032, representing a compound annual growth rate of 10.0%. Unlike Europe's "replacement of existing stock," China's growth is largely driven by new "multi-purpose" projects: light poles simultaneously serve functions such as lighting, monitoring, 5G micro base stations, and environmental monitoring. Communication solutions tend to favor fiber optic or wireless backhaul because the civil engineering of the light pole itself is already included, thus amortizing the marginal cost of laying separate communication cables. This means that the main opportunity for PLCs in the Chinese street lighting market lies not in "building new smart light poles," but in the niche scenario of "energy-saving retrofitting of existing road lighting." Many urban roads in China only have power cables in their lighting circuits, lacking communication lines. If only single-lamp control, dimming, and fault feedback are required, PLCs offer better engineering economics than rewiring. A study published in the 8th issue of *China Lighting Appliances* in 2026 points to this logic: traditional control modes are energy-intensive and difficult to maintain, while mainstream wireless communication solutions are easily affected by terrain obstruction in densely populated urban areas. PLCs, utilizing existing cables for data transmission, offer advantages such as low cost and reliable connection. The Southeast Asian market is in an earlier stage. In March 2026, Terengganu, Malaysia, installed the state's first 5G smart lamppost at the Kedebayan Market, integrating smart lighting, monitoring, environmental monitoring, and electric vehicle charging functions. These markets share common characteristics: real incremental demand, but projects are small-scale, budgets are fragmented, and there is a higher sensitivity to module costs than to brand premiums. In these markets, PLC modules are more likely to follow lighting solution providers overseas rather than independently building brand recognition.   The strategic position of the Qogrisys S130N-ISI in this landscape The product parameters of the S130N-ISI need to be understood within the context of the aforementioned market differences. It is based on the Leadcore VC6330, with an LCC package size of 20.6×12.6mm, supports both Q/GDW 11612 and IEEE 1901.1 protocols, and provides UART, PWM, GPIO, ADC, and SPI interfaces, integrating a built-in wire driver. According to official data from Leadcore regarding the VC6330 chip, application-layer communication rates can reach 1Mbps, with attenuation resistance exceeding 112dB, and a 99.99% communication success rate in actual projects. These parameters address the question of "whether it can be used," but the "usability" in different markets depends on the line conditions and system integration quality. The aging of the lines in European projects, the distribution of interference sources in Chinese projects, and the differences in construction specifications in Southeast Asian projects all affect the actual performance of the PLC. In street lighting scenarios, the value of the S130N-ISI lies not in promising "it will work immediately after installation," but in providing a hardware option that meets basic engineering requirements in three dimensions: protocol matching (Q/GDW 11612, IEEE 1901.1), size adaptation (20.6×12.6mm can be embedded in a single lamp controller), and interface integration (PWM dimming, ADC acquisition). One fact that requires careful consideration is that publicly available authoritative data on the actual global adoption rate of PLCs in smart streetlights is limited. What can be confirmed is that PLCs are one of the official options for smart streetlight connectivity, with academic research and engineering practice supporting their feasibility under specific conditions. However, conclusions such as "PLCs will dominate streetlight communication" lack data support. For engineering teams evaluating solutions, a more pragmatic approach is to test the wiring first, then select the modules. Only when the line impedance and signal-to-noise ratio are within reasonable ranges can the wiring-free advantage of PLCs translate into savings in construction time and costs; if test results are unsatisfactory, the costs of forcing PLC implementation may only become apparent during the commissioning phase.   Conclusion: The window of opportunity belongs to solution providers who clearly explain the "constraints". The global smart street light market's 20.4% CAGR provides a real window, but this window opens differently in different regions. In Europe, mandatory policies have created a definite demand for retrofitting existing infrastructure, where the wiring-free advantage of PLCs has the clearest engineering logic. In China, incremental growth is concentrated in the construction of new multi-functional light poles, where PLCs have opportunities in the energy-saving retrofitting of existing roads. In Southeast Asia, the early-stage market is testing the cost competitiveness of modules. In this context, the S130N-ISI isn't a "universal street light module," but rather a PLC hardware option that adapts to the needs of single-lamp controllers in terms of protocol, size, and interface. Its value lies not in the absolute values of its specifications, but in its compatibility with the specific project's wiring conditions. For the engineering team, this means resolving the "do we need to break the road?" question at the project initiation meeting, rather than discovering during the commissioning phase that line noise is causing communication success rates far below expectations. Testing the line first, then selecting the module—reversing this order might save you a quote, but cost you the entire road's commissioning time.  

I. The Real-World Coordinates of the Wi-Fi 8 Standard Progress Just two days ago, Qualcomm's Dragonwing platform released a signal at Network X 2026 – the Wi-Fi 8 gateway solution was launched. To understand this, we need to clarify the current standard stage of Wi-Fi 8. At the IEEE plenary meeting in Montreal in July 2026, the 802.11bn task force voted to submit Draft 2.0 to the working group for a vote, thus finalizing the core features of Wi-Fi 8. According to the timeline disclosed by ABI Research, Draft 3.0 voting is scheduled for January 2027, Draft 4.0/initial standards association voting is targeted for May 2027, final working group approval is set for March 2028, IEEE standards committee approval is expected for May 2028, and the Wi-Fi Alliance certification program is expected to launch in January 2028. The key implication of this timeline is that Wi-Fi 8 will still be in the draft standard stage in 2026, with certified products and large-scale commercialization not truly starting until 2028. However, chip platform and module solution providers have already significantly accelerated their product development pace. Broadcom was the first to release Wi-Fi 8 chipsets in October 2025, followed by MediaTek and Qualcomm. By September 2026, the Wi-Fi Alliance had already held its first Wi-Fi 8 pre-certification interoperability Plugfest in Beijing, Taipei, and California. While the standard has not yet been finalized, the industry's engineering preparations are already in full swing. II. The Differentiated Deployment Logic of Qualcomm's Dragonwing Platform Qualcomm's Dragonwing product portfolio, showcased at Network X 2026, presents a clear market segmentation strategy. designed for mainstream fiber broadband gateways . According to Qualcomm's official product briefing, the F8 integrates Wi-Fi 8 connectivity and native PON architecture support, targeting Home Gateway Units (HGUs) and Single Units (SFUs). Key specifications include: peak wireless capacity of 23Gbps, support for up to 750 concurrent clients, up to three-band operation and a 14-antenna configuration , flexible RF configuration allowing for a 5x5 mode or splitting into dual-band simultaneous 2x2+3x3 modes, and native support for GPON, XG-PON, and XGS-PON standards. The platform supports open-source middleware such as prplOS, OpenWRT, RDK, and OpenSync, and is equipped with a dedicated scanning radio frequency for automatic channel selection and radar detection. designed for high-end enterprise access points (APs) and flagship home routers . Its specifications are significantly improved: peak wireless capacity of 33Gbps, support for up to 1500 concurrent clients, up to five frequency bands and a 20-antenna configuration , integrated five-core CPU and Hexagon NPU, and support for edge AI inference. Developed in collaboration with GFiber, this platform, a Wi-Fi 8 Premium Gateway, aims to support symmetric 20Gig broadband services, redefining the gateway from a "connected device" to a "smart service platform." Meig Smart chose to launch its Wi-Fi 8 gateway solution on the N8 platform, officially announcing it at Network X 2026 on October 14th. The industry significance of this launch lies in the fact that the entire engineering transformation chain of a Wi-Fi 8 gateway, from chip platform to deliverable solution, has been fully demonstrated for the first time. For downstream customers, the Wi-Fi 8 gateway is no longer a distant concept "waiting for the standard to be finalized," but rather an evaluable chip base and a referenceable solution design. III. Generational Positioning of Qogrisys Gateway Module Product Line Although manufacturers are currently rushing to implement their strategies in advance, WiFi 7 and WiFi 6 remain the mainstays of shipments. They are more mature than WiFi 8 and are still the preferred choice. During this window of opportunity before the Wi-Fi 8 standard is finalized, gateway module solution providers need to strike a balance between technological foresight and market deliverability in their product strategies. Qogrisys's two main gateway module products are precisely designed to meet different levels of demand during this transition period. Wi-Fi 7 Platform: O2072PM and O2072PB The O2072PM is based on the Qualcomm FastConnect C7700 (QCC2072) chip, uses a standard M.2 Key E interface (22×30mm), and supports Wi-Fi 7 (802.11be) and Bluetooth 6.0. Its core capabilities include: tri-band 2.4/5/6GHz concurrent operation; the 6GHz band supports 320MHz channel bandwidth and 4096QAM modulation, with a peak rate of 5.8Gbps ; and it supports 320MHz Enhanced Multi-Link Single Radio (eMLSR) , enabling millisecond-level switching when the link is interfered with. This module has completed driver adaptation for Intel x86 platforms with kernels 5.15.24+, 6.1.99, and 6.12.0. The O2072PB is based on the same QCC2072 chip and uses a 15×13mm surface mount package, targeting space-constrained onboard integration scenarios. Wi-Fi 6E Platform: O2066PM and O2066PB The O2066PM is based on the Qualcomm QCA2066 chip and uses a standard M.2 2230 Key E interface (22×30×2.7mm), supporting Wi-Fi 6E (802.11ax) and Bluetooth 5.2. Key specifications include: tri-band 2.4/5/6GHz support, dual-band simultaneous (DBS) operation, and a maximum speed of 2975.6Mbps ; support for 2×2 MU-MIMO, 160MHz channel bandwidth, and dynamic frequency selection (DFS radar detection). The Bluetooth interface supports both UART/PCM and USB configurations. The module operates in a temperature range of -30℃ to +85℃ , exhibiting industrial-grade stability. In VR products, it has achieved a measured throughput of 2.1Gbit/s and has been designed into customer VR products, which were showcased at CES 2023. The O2066PB is based on the same QCA2066 chip, and its core capabilities are identical to the O2066PM; the difference lies in its package form. It uses a small SMT LGA package, measuring 13×15×2.3mm , targeting space-constrained onboard integration scenarios. Wi-Fi uses a PCIe interface, and Bluetooth uses a UART/PCM interface. Its operating temperature range is -30℃ to +70℃ , making it suitable for consumer-grade terminal devices. the O2072 series is logically consistent with the "high reliability connection" emphasized by Wi-Fi 8—Wi-Fi 7's MLO provides an engineering implementation of link redundancy, while Wi-Fi 8's Multi-AP Coordination (MAPC) extends the coordination scope from a single device to a multi-node network. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-end and mid-range gateways, Wi-Fi 6E's 6GHz band capability provides cost-sensitive customers with a "partial generational upgrade" option . IV. Generational Transition Logic Between Chip Platforms and Module Products From Wi-Fi 6E to Wi-Fi 7 and then to Wi-Fi 8, the technological evolution path of gateway modules shows a clear continuity. The core improvement of Wi-Fi 8 over Wi-Fi 7 lies not in peak speed . According to industry technical analysis, Wi-Fi 8 is compatible with Wi-Fi 7's 2.4/5/6GHz tri-band, 320MHz channel, and 4096QAM. Existing Wi-Fi 7 RF architectures can support these core features through firmware upgrades . Wi-Fi 8 offers approximately double the actual throughput and reduces P99 latency to about one-sixth of Wi-Fi 7. Its core value lies in reliability, coverage, and concurrency efficiency in high-density/long-distance scenarios , achieved through multi-AP collaboration, dynamic resource scheduling, and enhanced link design. Wi-Fi 7 addressed "speed," while Wi-Fi 8 addresses "stability." The eMLSR multi-link operation capability and tri-band concurrent architecture already possessed by the O2072 series from Qogrisys are engineering implementations on the Wi-Fi 7 platform. As the Wi-Fi 8 MAPC protocol stack and enhanced long-range response (ELR) features mature, module products based on the Wi-Fi 7 RF architecture have the engineering foundation to migrate to Wi-Fi 8 features at the hardware level . The core challenges lie in upgrading the software protocol stack and implementing multi-AP coordination functions. The O2066 series represents another path: during the transition period when the cost of Wi-Fi 7 modules has not yet dropped to an acceptable level for low-to-mid-range gateways, the 6GHz band capability of Wi-Fi 6E provides cost-sensitive customers with a "partial generational upgrade" option . V. Conclusion Qualcomm's Dragonwing platform was publicly launched as a Wi-Fi 8 gateway solution during Network X 2026, marking the transition of Wi-Fi 8 from the standard draft and chip prototype stages to the gateway product engineering stage . Meig Smart's solution release validates the transformation path from chip platform to deliverable gateway, and also indicates that the competitive pace among module solution providers has shifted from "following after the standard is frozen" to "parallel development during the standard draft stage." For gateway module solution providers, the core task at this stage is not to "get a head start" on the Wi-Fi 8 platform, but to accumulate transferable engineering capabilities on the Wi-Fi 7 and Wi-Fi 6E platforms. The experience of O2072PM / O2072P B in eMLSR multi-link operation, the accumulated RF engineering expertise in tri-band concurrent architecture, and the cost optimization path of O2066PM / O2066P B in the 6GHz band together constitute the product positioning for the transition to the Wi-Fi 8 era. From a longer-term perspective, Wi-Fi 8 redefines the gateway from a "wireless coverage device" to an "access node in a multi-AP coordinated network." This role change requires module solution providers to extend their capabilities beyond simple RF engineering and driver adaptation to system-level capabilities such as network topology planning, multi-node collaborative scheduling, and deployment scenario adaptation. During the standard window of 2026-2027, module solution providers' product strategies need to find a balance between "technological foresight" and "current deliverability"—Wi -Fi 7 modules serve current high-end gateway needs, Wi-Fi 6E modules cover cost-sensitive scenarios, and Wi-Fi 8 productization preparation needs to be quickly integrated as soon as the chip platform becomes available.  

I. 受理ロジックの変更：「設置されているかどうか」から「テストされた場合のみカウント」へ。 深センでは、屋上太陽光発電プロジェクトの受け入れ基準が大幅に引き上げられています。深センの地方工学建設基準SJG 220-2026が施行され、ラピッドシャットダウンに関する正確な定量的指標が設定されています。シャットダウンアクションは30秒以内に完了する必要があり、太陽光発電アレイから1メートル以内の電圧は80V未満に、1メートルを超える電圧は30V未満に低下する必要があります。 これは単に「ラピッドシャットダウンの設置」として片付けられるものではありません。現場の受け入れ担当者は、まずすべてのシャットダウントリガーポイントを特定し、非常口、インバータの近く、リモートコントロール端子でのロジックの一貫性を確認します。次に、シャットダウンデバイスとコンポーネントの対応を確認します。最後に、図面に指定された測定ポイントでの時間と電圧を記録し、プロジェクトで採用されたバージョン内外のアレイ境界が要件を満たしていることを確認します。「BOMにRSDが記載されている」と言うだけでは、もはや受け入れには十分ではありません。システムレベルの電圧制御性能が最終基準となります。 上海グループ標準T/ESETA 000007—2026は、要件をさらに精緻化しています。シャットダウンはトリガー後30秒以内に完了する必要があり、到達可能な境界の外側の電圧は≤30V、内側の電圧は≤120V、出力電力は≤1Wである必要があります。また、「シャットダウンはコンポーネントレベルとストリングレベルに分かれており、人口密度の高い場所ではコンポーネントレベルのソリューションを優先すべきである」と明確に述べています。 北米市場にはより厳しい参入障壁があります。NEC 690.12では、アレイ境界外の制御導体は30秒以内に30V未満に低下する必要があり、境界内の消防士の感電保護は、リストされたPVHCSデバイスまたは電圧制限方法によって達成される必要があると要求しています。PLCソリューションを選択する際、チップの変調方法とノイズ耐性は、システムがサポートできるコンポーネントの数を直接決定します。 II. SunSpecの階層的ロジック：チップ準拠≠モジュール認証≠完全システム承認 これは、スイッチメーカーやモジュール購入者が見落としがちな重要な問題です。 SunSpec Allianceの「ラピッドシャットダウン用通信信号」仕様は、送信機と受信機間の通信プロトコルを定義しています。送信機は「運用」状態で信号を継続的に送信し、受信機は信号損失を検出するとシャットダウンをトリガーします。SunSpec Allianceは明確に述べています：「'SunSpec Certified'マークのみが、SunSpecラピッドシャットダウン通信信号機能仕様の完全かつ成功した実装を証明します。メーカーまたはその他の第三者による「SunSpec準拠」または「SunSpec互換性」の主張は、SunSpecが発行した証明書と同等ではありません。」 これは、プロトコルに対するチップサポート、コンフォーマンステストに合格したモジュール、および完全なデバイス認証は、3つの独立した検証レベルであることを意味します。 モジュールレベルのプロトコル互換性は最初のハードルに過ぎません。UL 1741やCSA C22.2などの安全認証は、市場参入のパスポートです。この理解は、回路ブレーカーメーカーの選択決定にとって非常に重要です。   III. モジュール選択のための3つのエンジニアリング次元：サイズ、消費電力、およびネットワーキング機能 回路ブレーカーメーカーにとって、チップ仕様の「PLCサポート」と「統合ラインドライバ」機能は出発点に過ぎません。ソリューションが量産され実装されるかどうかを実際に決定するのは、モジュールレベルでのエンジニアリング適応性です。 最初の次元はサイズです。回路ブレーカーは各太陽光発電モジュールの背面パネルに取り付けられ、そこはスペースが非常に限られており、ジャンクションボックスやケーブルと共有されています。モジュールのパッケージサイズは、回路ブレーカーハウジングの設計スペースと設置方法を直接決定します。Hisilicon PS0211チップセットを使用したPLCモジュールは、通常、28.12×18.00mmのピンヘッダーパッケージまたは20.0×14.2mmのゴールドフィンガーパッケージを使用しますが、一部のモジュールメーカーはさらに小型化された20.0×11.0mmバージョンを発売しています。 2番目の次元は消費電力です。シャットダウンデバイスは太陽光発電パネル自体から電力を供給され、独立した電源入力はありません。HiSilicon PS0211ソリューションの静止消費電力は≤0.15W（グリッド接続、パケット送信なしの状態）、動的動作電力は≤0.5Wです。日照不足、モジュールが影になっている、または夜間の場合、モジュールはインバータ送信機から送信される「操作許可」信号を待つために、非常に低い待機電力消費に依存する必要があります。 3番目の次元はネットワーキング機能です。PLC信号はDC電力線経由で送信され、STAノードとして機能するシャットダウンデバイスは、インバータエンドのCCOとの信頼性の高い通信リンクを確立する必要があります。HiSilicon PS0211ソリューションは、典型的な200ノード、2層ネットワークシナリオで10秒以内に高速ネットワーキングをサポートし、動的ルーティングとマルチパスアドレッシング、およびユニキャスト、マルチキャスト、ブロードキャストコマンド伝播方法をサポートします。分散型太陽光発電システムにおける複数のコンポーネントおよびデバイスの統一アクセス要件にとって、モジュールのネットワーキング規模と時間性能は、システムコミッショニング効率に直接影響します。 IV. Qogrisysyの2つのPLCモジュールのシーンアライメント太陽光発電シャットダウンPLCモジュールの選択において、Qogrisysyは異なるチップソリューションに基づいた2つの製品を提供しており、それぞれ異なるエンジニアリングの焦点を表しています。 S130N-ISI（Linktronics VC6330ソリューション） は、その超小型サイズです。このモジュールはLCCパッケージを使用し、PCBサイズは12.6×20.6×2.5mmに制御されています。-20℃から80℃の温度範囲、-40℃から125℃の保管温度で動作し、SGCC 0〜12MHz帯域幅とIEEE 1901.1通信プロトコルをサポートしています。スペースが非常に限られているスイッチギア設計では、モジュールの物理的なサイズが最初のスクリーニングハードルとなることがよくあります。スペースが非常に限られているラピッドシャットダウンユニット（RSU）エンクロージャーの設計では、モジュールの物理的な寸法が主要なスクリーニング基準となることがよくあります。RSUメーカーにとって、モジュールレベルでのエンジニアリング互換性は、特定のチップパラメータよりも重要です。ユニットはPVモジュールの背面に取り付けられ、スペースが非常に限られているエリアであり、PVパネル自体から電力を供給され、マイクロワットレベルの電力消費で動作しながらPLC信号を継続的に監視する必要があります。モジュール寸法、消費電力特性、および広範な温度範囲での信頼性という3つの次元にわたるエンジニアリングメトリックは、完全なRSUが実際の屋上環境で安定して動作できるかどうかを直接決定します。 V. 主要な結論 第一に、PLCはコンポーネントレベルでのラピッドシャットダウンに最適な技術ソリューションです。 SunSpec仕様は、PLCを通信信号キャリアとして明確に使用し、DC電力線を多重化して制御信号を送信するため、各コンポーネントに個別の通信ラインを敷設するコストと信頼性のリスクを回避します。第二に、受け入れ基準は「機能性」から「測定可能な有効性」へと移行しています。 SJG 220-2026の30秒/80V/30V仕様と上海グループ標準の定量的要件は、高速シャットダウンソリューションの設計が現場テストに耐える必要があることを意味します。第三に、モジュール選択のコア考慮事項は、「チップパラメータ」から「エンジニアリング適応性」へと移行する必要があります。 シャットダウンユニットのスペース制約、自己給電条件下での消費電力制約、分散型シナリオでのネットワーク規模制約という3つのエンジニアリング指標は、ソリューションが量産され実装できるかどうかを決定する鍵となります。第四に、認証レベルの認識は、回路ブレーカーメーカーが確立する必要のある能力です。 SunSpecプロトコルに対するチップサポート、SunSpecによるモジュール認証、UL 1741安全規格による完全ユニット認証は、3つの独立した検証レベルです。Hisilicon PS0211チップはSunSpec標準のサポートを明確に示しており、このチップに基づいたQogrisysy 3121N-Hモジュールは、回路ブレーカーメーカーの完全ユニット認証の基本的なプロトコルレベルの保証を提供します。第五に、モジュールサプライヤーの役割は、「デバイス提供」から「認証支援」へと拡大しています。 スイッチメーカーは、「使用可能なモジュール」以上のものを必要としています。彼らは、「SunSpecテストロジックの理解、システムネットワーキング設計の最適化、および全体システム認証の通過を支援する」ことができる技術パートナーを必要としています。